Silicon Performance and Characteristics
Index | Performance | |
AlN | Si | |
Substrate thickness | 0.1~1.2mm | 0.05~2 |
Density | 3.3~3.35 | 2.329 |
thermal conductivity （W/m.K） | 170~190 | 140 |
Resistivity(Ω▪cm） | >1014 | >103 |
Dielectric properties | <9.3 | 11.8 |
Dielectric loss | 0.001 | 0.001 |
Coefficient of thermal expansion | 4.5×10-6 | 2.6×10-6 |
Bending Strength(Mpa) | >300 | >125 |
Bulk micromachining | Hard | Easy |
Transmittance | Light-proof | Absorption off at infrared wavelength |
Surface roughness | <0.03um | <1nm |
Wafer size | Less than 4 inches | More than 6 inches |